The Electronic Cooling Module for SolidWorks Flow Simulation evaluates standard components' thermal properties and cooling requirements. Comprising of both analysis productivity tools and enhanced simulation functionality, the Electronic Cooling Module is a key tool for designers of electronic packaging.
The Electronic Cooling Module for SolidWorks Flow Simulation gives engineers great tools to tackle the tough challenges in electronic packaging design.
- Airflow Optimization
- Product Thermal Design
- Heatsink Selection/Design
- PCB Thermal Simulation
- Fan Selection
Aimed squarely at the mechanical engineer designing enclosures for electronic components, the Electronic Cooling Module provides great ease of use with great simulation power.
- Joule Heating
- Two Resistor Components
- Heat Pipes
- PCB Generators
- Engineering Database
The Electronic Cooling Module enables design engineers to quickly and accurately model complex electronic systems for thermal analysis. With its combination of ease of use and industry specific tools, the Electronic Cooling Module ensures maximum analysis productivity with enhanced simulation fidelity.
